Due to the use of advanced Bi-CMOS process and the overall optimized circuit structure, the product obtains extremely low input error feedback. The product adopts dynamic offset elimination technology, which can eliminate the offset voltage caused by package stress, thermal stress, and temperature gradient, and improve the consistency of the device. At the same time, the product adopts a very miniaturized packaging process, which makes the product have extremely high performance and market advantages.
CC6211 provides three packages: TSOT23-3, TO-92S and DFN4L, with an operating temperature range of -40~150.
Product features
Main applications
1.Instruments
Product parameters